The actual phones get the most attention at Mobile World Congress every year—the Samsung Galaxy S7, LG G5, and Xiaomi’s Mi 5 all look promising in different ways—but component announcements can give us some insight into what to expect later this year and at next year’s MWC. For example, Samsung has just announced 256GB NAND flash chips suitable for phones and tablets, many of which top out at 128GB today.
The capacity is interesting, but Samsung spends more time extolling the virtues of the Universal Flash Storage (UFS) 2.0 interface used to connect the storage to the rest of the phone.
