Samsung just announced a breakthrough in phone memory packaging, which fuses 3 GB of RAM and 32 GB of storage in a single small package, allowing the kit to occupy 40% less space in our smartphones than a similar setup does now. This will leave more space for a battery pack in slim handsets, or whatever the engineering teams decide to do with the free air left inside.
The brainiacs from Samsung have already started mass producing the industry’s first ePoP (embedded package on package) chip, which is a marked improvement over the current two-package eMCP memory solutions. The 3GB LPDDR3 mobile DRAM utilized runs at an I/O data transfer rate of 1,866 Mb/s, and comes with a 64-bit bandwidth.
